Park, Seungbae: search on Z-Library

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1

Defence of Cultural Relativism

Journal:

Cultura International Journal of Philosophy of Culture and Axiology

Year:

2011

Language:

english

File:

PDF, 4.17 MB

english, 2011

2

How to Overcome Antirealists’ Objections to Scientific Realism

Journal:

Year:

2019

Language:

english

File:

PDF, 576 KB

english, 2019

3

Diagnostic Accuracy of the Neck Tornado Test as a New Screening Test in Cervical Radiculopathy

Park, Juyeon, Park, Woo Young, Hong, Seungbae, An, Jiwon, Koh, Jae Chul, Lee, Youn-Woo, Kim, Yong Chan, Choi, Jong Bum

Journal:

International Journal of Medical Sciences

Year:

2017

Language:

english

File:

PDF, 815 KB

english, 2017

4

Design, fabrication, and experimental characterization of a flap valve IPMC micropump with a flexibly supported diaphragm

Thanh Tung Nguyen, Nam Seo Goo, Vinh Khanh Nguyen, Youngtai Yoo, Seungbae Park

Journal:

Sensors and Actuators A: Physical

Year:

2008

Language:

english

File:

PDF, 1.03 MB

english, 2008

5

Surrealism Is Not an Alternative to Scientific Realism

Journal:

Logos & Episteme

Year:

2019

File:

PDF, 214 KB

2019

6

Problems with Using Evolutionary Theory in Philosophy

Journal:

Year:

2017

Language:

english

File:

PDF, 361 KB

english, 2017

7

The Anti-induction for Scientific Realism

Journal:

Grazer Philosophische Studien

Year:

2018

Language:

english

File:

PDF, 150 KB

english, 2018

8

A Note on the Normalized Approach to Simulating Moisture Diffusion in a Multimaterial System Under Transient Thermal Conditions Using ansys 14 and 14.5

Liu, Dapeng, Park, Seungbae

Journal:

Journal of Electronic Packaging

Year:

2014

Language:

english

File:

PDF, 397 KB

english, 2014

9

Statistical Analysis for Component Shift in Pick and Place Process of Surface Mount Technology

Cao, Shun, Parviziomran, Irandokht, Park, Seungbae, Won, Daehan

Journal:

Procedia Manufacturing

Year:

2019

Language:

english

File:

PDF, 771 KB

english, 2019

10

Characterization of elasto-plastic behavior of actual SAC solder joints for drop test modeling

Tung T. Nguyen, Seungbae Park

Journal:

Microelectronics Reliability

Year:

2011

Language:

english

File:

PDF, 1.59 MB

english, 2011

11

Thermodynamics and Kinetics of Oxidation of Pure Indium Solders

Schoeller, Harry, Kim, Jongman, Park, Seungbae, Cho, Junghyun

Journal:

MRS Proceedings

Year:

2006

Language:

english

File:

PDF, 210 KB

english, 2006

12

On the Evolutionary Defense of Scientific Antirealism

Journal:

Year:

2014

Language:

english

File:

PDF, 168 KB

english, 2014

13

[IEEE 2016 IEEE 20th Workshop on Signal and Power Integrity (SPI) - Turin, Italy (2016.5.8-2016.5.11)] 2016 IEEE 20th Workshop on Signal and Power Integrity (SPI) - Simulation-based analysis on EMI effect in LPDDR interface for mitigating RFI in a mobile environment

Kim, Seil, Moon, Sungwook, Lee, Seungbae, Yi, Donny, Park, Goeun, Shin, Sangchul, Pae, Sangwoo

Year:

2016

Language:

english

File:

PDF, 720 KB

english, 2016

14

Scientific Understanding, Fictional Understanding, and Scientific Progress

Journal:

Journal for General Philosophy of Science

Year:

2019

Language:

english

File:

PDF, 634 KB

english, 2019

15

Reliability Assessment of Preloaded Solder Joint Under Thermal Cycling

Yu, Da, Lee, Hohyung, Park, Seungbae

Journal:

Journal of Electronic Packaging

Year:

2012

Language:

english

File:

PDF, 2.47 MB

english, 2012

16

In Defense of the Epistemic Imperative

Journal:

Year:

2018

Language:

english

File:

PDF, 605 KB

english, 2018

17

Predictive Model for Optimized Design Parameters in Flip-Chip Packages and Assemblies

Park, Seungbae, Lee, H. C., Sammakia, Bahgat, Raghunathan, Karthik

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2007

Language:

english

File:

PDF, 869 KB

english, 2007

18

A Confutation of the Pessimistic Induction

Journal:

Journal for General Philosophy of Science

Year:

2011

Language:

english

File:

PDF, 131 KB

english, 2011

19

Effects of Phase Change of Pb-Free Flip-Chip Solders During Board-Level Interconnect Reflow

Chung, Soonwan, Tang, Zhenming, Park, Seungbae

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 1.24 MB

english, 2007

20

[ASME ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels - San Francisco, California, USA (Monday 6 July 2015)] Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays - Shrinkage of Post-Cure Die Attach Adhesives During Isothermal Storage

Liu, Ruiyang, Lee, HoHyung, Park, Seungbae, Xue, Xiaojie

Year:

2015

Language:

english

File:

PDF, 2.65 MB

english, 2015

21

Prediction of Component Shifts in Pick and Place Process of Surface Mount Technology Using Support Vector Regression

Cao, Shun, Parviziomran, Irandokht, Yang, Haeyong, Park, Seungbae, Won, Daehan

Journal:

Procedia Manufacturing

Year:

2019

File:

PDF, 948 KB

2019

22

[IEEE 2020 IEEE International Reliability Physics Symposium (IRPS) - Dallas, TX, USA (2020.4.28-2020.5.30)] 2020 IEEE International Reliability Physics Symposium (IRPS) - Investigating of SER in 28 nm FDSOI-Planar and Comparing with SER in Bulk-FinFET

Uemura, Taiki, Chung, Byungjin, Jo, Jeongmin, Jiang, Hai, Ji, Yongsung, Jeong, Tae-Young, Ranjan, Rakesh, Park, Youngin, Hong, Kiil, Lee, Seungbae, Rhee, Hwasung, Pae, Sangwoo, Lee, Euncheol, Choi, Ja

Year:

2020

File:

PDF, 599 KB

2020

23

Philosophical Responses to Underdetermination in Science

Journal:

Journal for General Philosophy of Science

Year:

2009

Language:

english

File:

PDF, 1014 KB

english, 2009

24

[ASME ASME 2006 International Mechanical Engineering Congress and Exposition - Chicago, Illinois, USA (November 5 – 10, 2006)] Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology - Wrinkling of Thin Membrane Under Thermal Loading

Gao, Jia, Park, Seungbae, Pitarresi, James, Homentcovschi, Dorel

Year:

2006

Language:

english

File:

PDF, 704 KB

english, 2006

25

[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Investigation of underfilling BGAs packages â Thermal fatigue

Pham, Van-Lai, Xu, Jiefeng, Pan, Ke, Wang, Jing, Park, Seungbae, Singh, Charandeep, Wang, Huayan

Year:

2020

File:

PDF, 456 KB

2020

26

Electrodeposition of flower-like nickel oxide on CVD-grown graphene to develop an electrochemical non-enzymatic biosensor

Rengaraj, Arunkumar, Haldorai, Yuvaraj, Kwak, Cheol Hwan, Ahn, Seungbae, Jeon, Ki-Joon, Park, Seok Hoon, Han, Young-Kyu, Huh, Yun Suk

Journal:

Journal of Materials Chemistry B

Year:

2015

Language:

english

File:

PDF, 3.32 MB

english, 2015

27

Prediction of deformation during manufacturing processes of silicon interposer package with TSVs

Kim, Yeonsung, Park, Ah-Young, Kao, Chin-Li, Su, Michael, Black, Bryan, Park, Seungbae

Journal:

Microelectronics Reliability

Year:

2016

Language:

english

File:

PDF, 1.96 MB

english, 2016

28

[IEEE 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2020.7.21-2020.7.23)] 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Shock Performance Enhancement of a Container for Rack Server

Yin, Pengcheng, Wang, Huayan, Xu, Jiefeng, Pham, Vanlai, Park, Seungbae

Year:

2020

File:

PDF, 1.18 MB

2020

29

Shaping Rollable Display Devices: Effects of Gripping Condition, Device Thickness, and Hand Length on Bimanual Perceived Grip Comfort

Lee, Songil, Kyung, Gyouhyung, Kim, Minjoong, Choi, Donghee, Choi, Hyeeun, Hwang, Kitae, Park, Seonghyeok, Kim, Su Young, Lee, Seungbae

Journal:

Human Factors The Journal of the Human Factors and Ergonomics Society

Year:

2019

File:

PDF, 1.02 MB

2019

30

[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Finite element based fatigue life prediction for electronic components under random vibration loading

Yu, Da, Al-Yafawi, Abdullah, Park, Seungbae, Chung, Soonwan

Year:

2010

Language:

english

File:

PDF, 1.54 MB

english, 2010

31

Investigation of Stress in MEMS Sensor Device Due to Hygroscopic and Viscoelastic Behavior of Molding Compound

Yeonsung Kim,, Dapeng Liu,, Hohyung Lee,, Ruiyang Liu,, Sengupta, Dipak, Seungbae Park,

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2015

Language:

english

File:

PDF, 4.27 MB

english, 2015

32

Advanced Thermal-Moisture Analogy Scheme for Anisothermal Moisture Diffusion Problem

Jang, Changsoo, Park, Seungbae, Han, Bongtae, Yoon, Samson

Journal:

Journal of Electronic Packaging

Year:

2008

Language:

english

File:

PDF, 797 KB

english, 2008

33

[ASME ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems - Portland, Oregon, USA (July 6–8, 2011)] ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1 - Solder Joint Reliability in Underfilled Flip Chip Package With a Consideration of Chip-Package-Interaction (CPI)

Kwak, Jae B., Yu, Da, Nguyen, Tung T., Park, Seungbae

Year:

2011

Language:

english

File:

PDF, 684 KB

english, 2011

34

Transport phenomena in proton exchange membrane fuel cells and over-potential distribution of membrane electrode assembly

Dong-Myung Suh, Seungbae Park

Journal:

International Journal of Thermal Sciences

Year:

2012

Language:

english

File:

PDF, 1.19 MB

english, 2012

35

An Eulerian approach for constructing a map between surfaces with different topologies

Park, Hangil, Cho, Youngjin, Bang, Seungbae, Lee, Sung-Hee

Journal:

Computer Graphics Forum

Year:

2016

Language:

english

File:

PDF, 9.06 MB

english, 2016

36

[ASME ASME 2006 International Mechanical Engineering Congress and Exposition - Chicago, Illinois, USA (November 5 – 10, 2006)] Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology - Solderability of Indium With Various Oxide Thickness

Park, Seungbae, Kim, Jongman, Cho, Junghyun, Schoeller, Harry

Year:

2006

Language:

english

File:

PDF, 4.61 MB

english, 2006

37

Advancement in simulating moisture diffusion in electronic packages under dynamic thermal loading conditions

Wang, Jing, Liu, Ruiyang, Liu, Dapeng, Park, Seungbae

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 2.44 MB

english, 2017

38

Gain enhancement of a microstrip patch antenna using a circularly periodic EBG structure and air layer

Seungbae Park, Cheolbok Kim, Youngho Jung, Hosang Lee, Dongki Cho, Munsoo Lee

Journal:

AEU - International Journal of Electronics and Communications

Year:

2010

Language:

english

File:

PDF, 931 KB

english, 2010

39

66-4: Effects of Display Curvature and Lateral Viewing Position on Spatial Presence and Image Quality for 55″ TVs

Park, Sungryul, Yi, Jihhyeon, Choi, Donghee, Lee, Songil, Kyung, Gyouhyung, Choi, Byeonghwa, Lee, Ja Eun, Lee, Seungbae

Journal:

SID Symposium Digest of Technical Papers

Year:

2016

Language:

english

File:

PDF, 582 KB

english, 2016

40

Effects of display curvature and task duration on proofreading performance, visual discomfort, visual fatigue, mental workload, and user satisfaction

Park, Sungryul, Kyung, Gyouhyung, Choi, Donghee, Yi, Jihhyeon, Lee, Songil, Choi, Byeonghwa, Lee, Seungbae

Journal:

Applied Ergonomics

Year:

2019

Language:

english

File:

PDF, 5.87 MB

english, 2019

41

[IEEE 2007 9th Electronics Packaging Technology Conference - Singapore (2007.12.10-2007.12.12)] 2007 9th Electronics Packaging Technology Conference - Effect of Boundary Conditions on the Dynamic Response Characterization Of Board-Level Drop Test

Park, Seungbae, Shah, Chirag, Kwak, Jae

Year:

2007

Language:

english

File:

PDF, 1.05 MB

english, 2007

42

Review of the F-16 Individual Aircraft Tracking Program

Lee, Hongchul, Cho, Hwanjeong, Park, Seungbae

Journal:

Journal of Aircraft

Year:

2012

Language:

english

File:

PDF, 2.83 MB

english, 2012

43

[ASME ASME 2006 International Mechanical Engineering Congress and Exposition - Chicago, Illinois, USA (November 5 – 10, 2006)] Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology - Viscoelastic Material Properties of SU-8 and Carbon-Nanotube-Reinforced SU-8 Materials

Park, Seungbae, Chung, Soonwan, Ackler, Harold, Makhar, Sandeep

Year:

2006

Language:

english

File:

PDF, 496 KB

english, 2006

44

[ASME ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems - San Francisco, California, USA (Tuesday 29 August 2017)] ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - An Investigation of Moisture-Induced Interfacial Delamination in Plastic IC Package During Solder Reflow

Wang, Jing, Niu, Yuling, Park, Seungbae

Year:

2017

Language:

english

File:

PDF, 1.61 MB

english, 2017

45

The Uniformity Principle vs. the Disuniformity Principle

Journal:

Year:

2017

Language:

english

File:

PDF, 277 KB

english, 2017

46

A comprehensive solution for modeling moisture induced delamination in electronic packaging during solder reflow

Wang, Jing, Niu, Yuling, Shao, Shuai, Wang, Huayan, Xu, Jiefeng, Pham, Vanlai, Park, Seungbae

Journal:

Microelectronics Reliability

Year:

2020

File:

PDF, 1.73 MB

2020

47

Effect of Shield-Can on Dynamic Response of Board-Level Assembly

Yu, Da, Kwak, Jae, Park, Seungbae, Chung, Soonwan, Yoon, Ji-Young

Journal:

Journal of Electronic Packaging

Year:

2012

Language:

english

File:

PDF, 3.61 MB

english, 2012

48

Design guideline on board-level thermomechanical reliability of 2.5D package

Shao, Shuai, Niu, Yuling, Wang, Jing, Liu, Ruiyang, Park, Seungbae, Lee, Hohyung, Yip, Laurene, Refai-Ahmed, Gamal

Journal:

Microelectronics Reliability

Year:

2020

File:

PDF, 4.67 MB

2020

49

Failure analysis of contact probe pins for SnPb and Sn applications

Changsoo Jang, Seungbae Park, Bill Infantolino, Lawrence Lehman, Ryan Morgan, Dipak Sengupta

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 717 KB

english, 2008

50

Dynamic responses of PCB under product-level free drop impact

Da Yu, Jae B. Kwak, Seungbae Park, John Lee

Journal:

Microelectronics Reliability

Year:

2010

Language:

english

File:

PDF, 2.08 MB

english, 2010

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